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LOPEC 2017 (Large-area Organic and Printed EleCtronics)

Conference
Tuesday, March 28, 2017 to Thursday, March 30, 2017
Munich, Germany

LOPEC (Large-area, Organic & Printed Electronics Convention) is the leading trade fair and the most important congress for the printed electronics industry. The event takes place at Messe München convention center. It is the leading global platform in the industry and provides support in every aspect of the industry, from application to research. It connects, inspires and puts ideas into practice. For today and tomorrow. This is the place where printed electronics come to life.

Printed electronics is a growing industry with a promising future. LOPEC's success mirrors this development. The figures speak for themselves.
Performance figures for LOPEC 2016:

  • 148 exhibitors from 18 countries
  • About 2,100 visitors, over half of them international guests from a total of 46 countries
  • 196 conference presentations from 27 countries
  • 96 percent of participants feel that LOPEC’s importance is stable and/or growing

The chance to form new business partnerships has long been one of the trade fair's main focuses. LOPEC is the ideal place to establish new business contacts. 88 percent of exhibitors were very happy with the number and quality of new business contacts they made. No wonder: One of the aspects that makes LOPEC so appealing is that 82 percent of visiting trade professionals are “decision-makers”. This means that your new business contacts will be at eye level.

As a trade fair that covers a cross-section of the industry, LOPEC showcases current trends, presents innovative products, highlights new market opportunities for the industry and helps foster the development of new materials, manufacturing technologies and applications. This exclusive business platform is geared towards all areas of the industry including any manufacturers or end-users of this cutting-edge technology.

All relevant business areas, and thus the entire value chain, are represented at LOPEC:

  • Materials
  • Manufacturing processes
  • Assembly and packaging technologys
  • System integration
  • Inspection and test systems
  • Devices
  • Applications
  • Services