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MEMS Manufacturing 2017

Wednesday, August 2, 2017 to Thursday, August 3, 2017
Santa Clara, California

MEMS manufacturing is a key enabler for the production of advanced sensors and actuators used in such applications as IoT, wearables, autonomous vehicles, robotics, digital health, precision agriculture, smart home, environmental monitoring, and many others.

According to MEMS Journal research, the MEMS market will reach an “inflection point” in the 2018-2019 time frame which will change the economics of production to dramatically reduce costs and, therefore, significantly increase the utilization of MEMS devices throughout major industrial segments.

Given this “inflection point” and sharp reduction in production costs, can the MEMS market grow to $100 billion and 1 trillion MEMS devices per year by 2025? We believe this can happen. Already, the MEMS market has been one of the few “shining stars” among its peers in the overall semiconductor market sector, and the economy on the whole. Currently, the total market for MEMS devices is around $11-12 billion per year and it is expected to grow at 12 to 15% for the next few years.

So what are the next-generation MEMS manufacturing technologies? And what are the MEMS applications that are driving the need for new fabrication techniques? These are the key questions that will drive the discussion at this seminal event, MEMS Manufacturing 2017, which will feature talks from the leading MEMS business and technology experts. The future is bright for MEMS -- attend this event to identify emerging MEMS manufacturing technology and application trends, exchange ideas, form new companies, and network with your industry peers!

Conference Topics

  • Global trends: market drivers, emerging applications, intellectual property factors, government policy effects, roadmap review and development.
  • Business aspects: competitive and market dynamics, “pure play” foundries vs. platform-based design approaches, technology transfer, IDM vs. fabless approaches, supply chain challenges, ecosystem development, cost management and reduction, market research and intelligence, product and service positioning.
  • Technology aspects: process selection and development, PDKs and design rules, design for manufacturing, scaling, yield improvement, IP blocks, rapid prototyping, high volume production.
  • Emerging technologies and processes: TSVs, 3D stacking, wafer level packaging, CMOS MEMS integration, EDA software and simulation tools, polymer and glass microfabrication, novel materials and coatings, lamination techniques, ultra-thin and flexible substrates.
  • Front-end production: equipment, tools, methodologies, case studies.
  • Testing and reliability: equipment, tools, methodologies, case studies.
  • Packaging: equipment, tools, methodologies, case studies.