TechConnect World/Nanotech 2015 - Conference and Expo
Final Call for Abstracts & Innovations - Friday Jan. 16 Nanotech 2015/TechConnect World Innovation Conference June 14-17, 2015 - Washington DC
For an InterNano supporting partnership 10% discount on registration enter our code: INANO10
Abstract submission will close on Friday, January 16, for the TechConnect World Innovation Conference, June 14-17, Gaylord Convention Center, Washington DC, USA. On behalf of our symposium organizers we warmly invite you to submit your research abstract and participate in this exciting international event.
How to Participate:
Submit Your Abstract - due January 16th
Submit your technical research and development innovations for review and consideration for podium or poster presentation.
Submit Your Innovation - due January 30th
We are looking for breakthrough technologies that are ready for licensing, corporate partnering, or investment opportunities.
Innovators and Prospectors Include:
- All U.S. Funding Agencies
- All U.S. National Labs
- Top-tier Academic Innovators
- State & Country Innovation Delegations • Global Corporate Innovation Prospectors
For further information, please visit: http://www.techconnectworld.com/World2015/
Authors of research submissions, upon acceptance, must register for the conference. For an InterNano supporting partnership 10% discount on registration enter our code: INANO10
About the event: The world’s largest nanotechnology event, Nanotech 2015, delivers application-focused research from the top international academic, government and private industry labs. Thousands of leading researchers, scientists, engineers and technology developers participate in Nanotech to identify new technology trends, development tools, product opportunities, R&D collaborations, and commercialization partners. Join the global community that has been working together for over 17 years to integrate nanotechnology into industry with a focus on scale, safety and cost-effectiveness.The joint TechConnect World and the National Innovation Summit is uniquely designed to accelerate the commercialization of innovations, out of the lab and into industry. TechConnect World is divided into a Technical Research Program and an Innovation Partnering Program, gathering the world's leading market-focused research and commercially-viable innovations into the largest global technology accelerator program.