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12th Annual Flexible Electronics & Displays Conference & Exhibition

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2013 flex conference logo

Call for Papers

Submission date extended to October 5, 2012

Join this unique  “must attend”  event in Phoenix, Arizona together  with  world leaders  in a vibrant highly interactive collaborative environment.
FlexTech Alliance invites you to submit an abstract for its 12th Annual Flexible Electronics & Displays Conference & Exhibition  (  The conference is a culmination of shared information  – highlighting technical breakthroughs and demonstrating working products in flexible, printed electronics and displays. Attracting registrants from more than 200 companies, universities, R&D labs, and government agencies, the conference will address global technical and business issues, and advancements impacting the flexible electronics and displays value and supply chains. Join this field of international experts from industry, academia and R&D. Submit your abstract on the latest technical and product advances in flexible, printed, electronics and displays. The conference  features the very latest  research and  developments in Flexible Electronics Applications, systems, devices, manufacturing, fabrication processes equipment and materials.

How to Submit an Abstract
To submit your conference paper for consideration, go to
Complete the form with your contact information and abstract. The abstract submission should be between 100 and 200 words.

Benefits of Presenting
Be recognized as a leader in this exciting and disruptive field of electronics. Selected presenters will receive  acknowledgement in the 2013FLEX program guide, on the conference website and in the conference proceedings.  Speakers  also  receive a significantly discounted conference registration fee and are eligible for discounts on exhibition and sponsorship pricing.

Topic Areas
Business Strategies and Market Overviews for Flexible, Printed Electronics and Displays

  • Business Development
  • Road Mapping
  • Challenges to Early Adoption
  • Customer Perspectives

Flexible Electronics-Based Applications and Products

  • Flexible Displays
  • E-Book and Mobile Devices
  • Solar/Photovoltaics
  • Solid State Lighting and OLEDs
  • Energy Storage/Batteries
  • Smart Sensor Systems/RFID
    • Bio Medical – smart bandages, health monitors
    • Smart Clothing
    • Neuro Prosthetic Devices
    • Packaging
    • Advertising, Point of Sales
    • Pharmaceuticals
    • Toys and Entertainment
    • Food Monitoring, Agricultural Sensing
    • Security – perimeter and building occupation sensing, toxic sensing
    • Structural Monitoring – civil and military infrastructure

Flexible Electronic Devices

  • Thin Film Transistors
  • Sensors and Detectors
  • Memory
  • Logic
  • Membranes
  • Device Design, Design Rules, Process Integration

Flexible Electronics Processes and Manufacturing

  • Additive Printing Processes
    • Inkjet, Gravure, Flexo, Screen Printing and Other Patterned Deposition
    • Print/Ink Optimization
  • Roll to Roll/Web Processing
  • Production Cost Reduction
  • Deposition Techniques and Equipment
  • Metrology
  • Flexible Electronics Production vs. Graphics
  • Printing Production
  • Hybrid Manufacturing, Packaging, and Assembly – integration of printed electronics and microelectronics
  • Digital Lithography

Flexible Electronics Materials

  • Substrates
  • Substrate Treatment to Optimize Films
  • Conductors, Insulators, Semiconductors, Light
  • Emitting
  • Functional Inks
  • Nanomaterials
  • Adhesives – removable, permanent
  • Encapsulants
  • ITO Replacement
  • Sustainable Materials

Supply Chain Development